These products will utilize certain key technologies, including
- Intel Sierra Forest CPU support on R670 and R770 CSP Edition products
- TDP trending up to 305W but allow up to 350W
- Memory: 8 channels of DDR5 memory per CPU with
- Dual DIMM per channel (32x total)
- RDIMM support up to 6400MTs 1DPC / 5200MTs 2DPC
- This is still under discussion and will only be offered on GNR High Speed I/O solutions targeted for PCI Gen 5 and CXL
- 88 PCIe 5.0 lanes per CPU (PCIe or CXL)
- 56 lanes north / 32 lanes south of socket
- NTB @ PCIe 5.0, higher PCIe P2P performance (vs SPR)
- PCIe bifurcation: x16, x8, x4, x2(Gen5)
- OCP 3.0 slot support at Gen5
- GPU support options
- Storage